| About Ed Ellis; International Inventor and Leader with Superior Organizational Skills |
| Member Since 1970 |
| Haven't been able to fill that thick film engineering position because you need an experienced senior thick film process engineer, while your budget permits only the hiring of a lesser experienced or entry level engineer? Let Ed Ellis help you reconcile the situation! Ed will come to your site to work, hands-on, with and mentor your entry level engineer(s) in thick film material, LTCC tape formulating and process technology. You can meet your thick film process engineering objectives and stay within your manpower budget at the same time! FREE Initial Telephone/E-Mail Consultation ! Contact Ed now and learn how he can help you and your company! Telephone: (850) 476-1858 Cell: (850) 748-5258 e-mail: admin@consultedellis.com |
| Ed Ellis President Principal Consultant 46 years Electronic Manufacturing |
If your problem involves one or more of the following words or phrases ... You are at the right place !
Cost reduction, productivity improvement, Intellectual Property, Intellectual Property litigation, SBIR
proposal, project planning, R&D, research and development, design of experiments, six-sigma,
6-sigma, downsizing, lean and agile, electronic, circuits, microelectronic, interconnects, print, fire,
surface mount, solder, thick film, resistor, conductor, dielectric, capacitor, potentiometer, sensor, RF,
microwave
Cost reduction, productivity improvement, Intellectual Property, Intellectual Property litigation, SBIR
proposal, project planning, R&D, research and development, design of experiments, six-sigma,
6-sigma, downsizing, lean and agile, electronic, circuits, microelectronic, interconnects, print, fire,
surface mount, solder, thick film, resistor, conductor, dielectric, capacitor, potentiometer, sensor, RF,
microwave
| Ed Ellis began his career in 1962 with CTS Corporation's Research and Development Department in Elkhart, Indiana where he was privileged to work with many of the pioneers in printed electronics technology. Ed, an avid student, became an expert printed electronic material formulator under their mentoring and progressed from a hands-on R&D Technician through a series of engineering and engineering management positions, to Director of R&D at a major CTS subsidiary before retiring from CTS with 26 years of service . Following his career with CTS, Ed assumed the position of Director of Engineering for Allen Bradley Company's thick film operation in Greensboro, North Carolina. After Allen Bradley closed its business there, Ed joined Clarostat Company of Dover, New Hampshire as Manager of R&D and Process Development where he spearheaded the implementation of infrared curing of Clarostat's proprietary printed electronic polymer resistor films. Pending Clarostat's purchase by British Tire and Rubber; Ed returned to Indiana in February 1991 and joined Delco Electronics, now Delphi Electronics & Safety. While at Delphi, Ed spearheaded a development of printed electronic materials processes and products designed for the power handling and heat dissipation needed by GM Hybrid Vehicles . Ed also formulated and developed printed electronic materials & processes for; pressure sensors; accelerometers; lean and agile manufacturing; embedded passives; multi-layer hybrids and a void-free solder joint process. Ed is an expert in IR firing and the formulating of IR fireable thick film materials. His work at Delphi resulted in 11 US Patents and numerous publications and awards which included Delphi Automotive System's "Boss Kettering" Award. In September 2001 Ed was inducted into the Delphi Innovation Hall of Fame, an honor extended to less than 1% of Delphi's world-wide workforce. Upon retiring from Delphi after 10 years of service, Ed joined Paratek Microwave, Inc., of Columbia, Maryland, where he directed the development of tunable printed electronic dielectric inks used in the fabrication of Paratek's tunable miniaturized front ends and smart scanning antennas for military and commercial telecommunications. His work resulted in US patent #6,905,989 "Tunable Dielectric Compositions Including Low Loss Glass" which issued June 14, 2005. Ed remained with Paratek until January 2003 when he relocated to Pensacola, Florida and began soliciting thick film related consulting opportunities. Ed holds B.S. & Master of Business Science degrees from Indiana University and a Doctorate in International Law from Columbus University. |
Recent Patents In Which Ed Ellis Named Inventor:
View Patents by number www.uspto.gov/
US 61/196,445 Method For Determining Empty Oxygen Tank and
Alarming 10/17/2008
US 2070238593 Method For Increasing Fitness Level
While Losing Body Weight 10/11/2007
US 6,905,989 Tunable Dielectric Compositions Including Low Loss
Glass 06/14/2005
US 6,834,538 B2 Spark Plug Mounted Thick Film Strain Gauge
12/28/2004
US 6,799,451 Spark Plug Mounted Thick Film Strain Gauge
01/20/2004
US 6,631,551 Method of Forming Integral Passive Electronic
Components on Organic Circuit Board Substrates 10/14/2003
US 6,233,817 Method of Forming Thick-Film Hybrid Circuits on A
Metal Circuit Board 05/22/2001
US 6,180,164 Method for Ruthenium-Based Thick Film Resistors
01/30/2001
US 6,022,756 Metal Diaphragm Sensor With Polysilicon Sensing
Elements and Methods Therefor 02/08/2000
US 5,898,359 Diffusion-Barrier Materials for Thick Film Piezoresistors
and Sensors Formed Therewith 04/27/1999
US 5,803,344 Dual-Solder Process for Enhancing Reliability of
Thick-Film Hybrid Circuits 09/08/1998
US 5,621,240 Segmented Thick Film Resistors 04/15/1997
US 5,463,367 Method for Forming Thick Film Resistors and
Compositions Therefor 10/31/1995
View Patents by number www.uspto.gov/
US 61/196,445 Method For Determining Empty Oxygen Tank and
Alarming 10/17/2008
US 2070238593 Method For Increasing Fitness Level
While Losing Body Weight 10/11/2007
US 6,905,989 Tunable Dielectric Compositions Including Low Loss
Glass 06/14/2005
US 6,834,538 B2 Spark Plug Mounted Thick Film Strain Gauge
12/28/2004
US 6,799,451 Spark Plug Mounted Thick Film Strain Gauge
01/20/2004
US 6,631,551 Method of Forming Integral Passive Electronic
Components on Organic Circuit Board Substrates 10/14/2003
US 6,233,817 Method of Forming Thick-Film Hybrid Circuits on A
Metal Circuit Board 05/22/2001
US 6,180,164 Method for Ruthenium-Based Thick Film Resistors
01/30/2001
US 6,022,756 Metal Diaphragm Sensor With Polysilicon Sensing
Elements and Methods Therefor 02/08/2000
US 5,898,359 Diffusion-Barrier Materials for Thick Film Piezoresistors
and Sensors Formed Therewith 04/27/1999
US 5,803,344 Dual-Solder Process for Enhancing Reliability of
Thick-Film Hybrid Circuits 09/08/1998
US 5,621,240 Segmented Thick Film Resistors 04/15/1997
US 5,463,367 Method for Forming Thick Film Resistors and
Compositions Therefor 10/31/1995
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